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China's capacity to supply thinner grinding wheels has improved, accelerating the pace of domestic substitution.
Release time:
2025-02-18
In recent years, with the development of chip miniaturization and the upgrading of heat dissipation requirements, the application demand for thinned grinding wheels has been continuously released.
As a major global producer and consumer of semiconductor wafers, China plays a pivotal role in the semiconductor industry chain.
Currently, the market share of domestically produced wafer thinning grinding wheels is relatively low, approximately 10%. This means a significant market share is still occupied by foreign Brands. However, this also presents a huge opportunity for substitution and potential market growth. With the increasing emphasis and support from the government on the semiconductor industry, and the continuous progress of domestic enterprises in technological research and development and production processes, we have reason to believe that the market share of domestically produced thinning grinding wheels will be significantly improved.
As an important component of semiconductor cutting and grinding tools, thinning grinding wheels come in a wide variety of types, each with its own characteristics. According to the different materials added, thinning grinding wheels can be divided into several types, including silicon carbide grinding wheels, diamond grinding wheels, aluminum oxide grinding wheels, gallium arsenide grinding wheels, ceramic grinding wheels, and resin grinding wheels. These different types of thinning grinding wheels have different advantages in terms of hardness, wear resistance, and cutting efficiency, and are suitable for semiconductor cutting and grinding needs of different materials and processes. Therefore, while promoting the development of domestically produced thinning grinding wheels, we also need to focus on technological innovation and product research and development to meet the diversified needs of the market.
Thinning grinding wheels are mainly used in the thinning and fine grinding processes of semiconductor wafers, and are one of the important tools for wafer thinning. The thinning process involves grinding and thinning the back material of the chip to achieve the target thickness. The thinning process not only reduces the package size and improves circuit performance, but also helps with chip heat dissipation and improves service life. In recent years, with the development of chip miniaturization and the upgrading of heat dissipation requirements, the application demand for thinning grinding wheels has been continuously released.
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